2.5D RF-SiP Development: an MSCOne Success Story

For the last 2 years, TEN TECH LLC has been a major contributor in the design of highly engineered 2.5D System-in-Package (SiP) for the defense industry. From initial mechanical & thermal feasibility and manufacturability study to ruggedization, durability, performance and fatigue life assessment under harsh shock, vibration and thermal environments, our engineers make extensive use of the CAE portfolio (MSC Apex, Nastran, Marc, scSTREAM, ...) available to them via the MSCOne licensing.